micas@qform3d.co.uk+44 (0) 1865 775412


QForm V8 software is implemented at commercial plants for economic benefit as well as at Universities for academic and research purposes.

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QForm-Extrusion is designed for aluminum and magnesium profile extrusion simulation.

- Fully coupled task

- Analysis tools

- Temperature taper for billet

- Force and temperature distribution during full process time

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QForm RingRolling is specially designed software for ring rolling simulation.

- The software has a direct data preparation interface with the most popular ring rolling machines.

- Dual mesh method provides fast and accurate simulation

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QForm-Extrusion Die Designer (QExDD)
is system for creating parametric 3D design of tooling sets for solid and hollow profiles extrusion from 2D drawings.

– Die development automation

– Bearing editor

– QForm-Extrusion integration

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Micas Simulations Limited (formelly Micas Services Limited) who commenced trading in 1977 supplying software for the Forging Industry. Since 1995 MICAS started to market and then contribute development of QForm Forging Simulation Software. Initially Micas covered UK customers but their service has grown to incorporate Europe and companies and countries in many other parts of the world.



QForm in Cambridge.


ALUMINIUM 2016 exhibition takes place in Dusseldorf from November 29 to December 1. QForm Extrusion simulation software and recent developments in the field of numerical simulation of aluminium pro


Lua coding in QForm VX Extrusion provides a unique opportunity for researches in the field of material science to develop new material models based on any kind of internal variables of any complex

At the beginning of September new release 8.1.3 of QForm VX has been built. It includes many new features and options that are listed in the document on this page.
Practical use of metalforming simulation for extending dies life
QuantorForm Ltd. and Forge Technology Inc. will present QForm Extrusion simulation software at the 11th International Aluminum Extrusion Technology Seminar & Exposition on May 2-6, 2016 in Chicago, Illinois USA.